High-resolution X-ray technology is widely used in failure analysis and production quality testing of electronic devices, e.g. solder joint inspection. Any material flaw and quality characteristic affecting the shape of solder joints can be detected:
The fully automated µAXI inspection software x|act, the microme|x offers fast and easy CAD programming as well as highest defect coverage and repeatability.
A nanoCT® provides even more information.
 | x|act offers live overlay of CAD-data in the live X-ray image. Information about the solder joint, e.g. pad numbering, related package or inspection results is available at any time. Visible in the X-ray image is missing heel fillet and complete missing solder at two gullwing solder joints. Cause of error: Poor solder paste pressure. |
 | Microfocus X-ray image of BGA solder joints in vertical top-down view: Four solder joints are connected by solder bridges. The solder penetrated a through-hole plating. Cause of error: Defective masking laquer. |
 | Microfocus X-ray image of BGA solder joints in oblique view at a detector angle of 55°: Two open solder joints are present; the soldering paste melted and wetted the pads, but did not form a junction with the solder balls. Cause of error: poor solder surface, oxide film. |
 | nanoCT® of two neighboured BGA solder joints. The solder joint at the
left is open: The soldering paste melted and wetted the pads, but did
not form a junction with the solder balls. The lighter areas are
different metallic phases.
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 | nanoCT® of a µBGA after 4000 temperature stress cycles. Due to a voxelsize of 0.5 microns, cracks with 8 to < 1 micron are detectable. |
 | Microfocus X-ray image QFN solder joints in oblique view at a detector angle of 45°: Two landings of two solder joints are not wetted. Cause of error: Poor solder paste pressure. |
 | Microfocus X-ray image of through-hole solder joints in oblique view at a detector angle of 50 °: The through-hole plating in the center is not properly soldered. The solder has wetted the pin, but not the plating wall. Cause of error: Poor wall metallization. |