Power electronics and hybrid technology
In power-electronic components, heat is transported via the solder joints to mostly very thick copper heat sinks. To ensure optimal heat transport, the solder joints must contain as few voids as possible. Hybrid components are often encased by highly X-ray absorbent cases made of tungsten and copper. Yet even under such difficult circumstances, phoenix|x-ray’s high-contrast microfocus-X-ray systems and detectors succeed in providing sharp images, which are crucial to the automated calculation of void size and percentage.
For
a basic feature comparison for the X-ray systems we recommend for these
applications, please go to Power electronics and hybrid technology.
 | Soldering surface of a power transistor on a printed circuit board. The two light spots on the right are two large, circular voids.
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 | Soldering surface of power semiconductors on ceramic substrate. Through the 3-mm-thick copper heat sink, substrate voids are visible. The solder joints of the semiconductors are free of voids. Even the thin aluminum bond wires are visible.
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 | Soldering surface inside a ceramic hybrid component with a tungsten-copper casing. In the center of the image, five through-holes are visible, two of which are not completely filled with solder, hence are standing out against the background.
Furthermore, gold bond wires are visible. |
For a basic feature comparison for the X-ray systems we recommend for these applications, please go to Power electronics and hybrid technology.
