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Semiconductors, Electronics

Semiconductors and other electronic components

The following table provides a basic feature comparison for the X-ray systems we recommend for this application:
microme|xnanome|xpcba|inspector
3D computed tomographyyes (optional)yes (optional)no
max. inspection area24” x 22”24” x 22”24“ x 18“
real-time detector resolution2 MPixel and 24" monitor2 MPixel (optional 4 MPixel) and 24" monitor848 x 480 Pixel
detail detectability<1µ<0,3µ (300nm)<2µ
max. magnificationup to 23.320xup to 25.000xup to 460x
automated X-ray inspectionBGA, CSP, QFP, QFN, PTH, Voiding Calculation, Wire SweepBGA, CSP, QFP, QFN, PTH, Voiding Calulation, Wire SweepBGA, Voiding Calculation
max. tube voltage180kV180kV130kV

For application examples, please go to Semiconductors and other electronic components.