Semiconductors and other electronic components
The following table provides a basic feature comparison for the X-ray systems we recommend for this application:
| microme|x | nanome|x | pcba|inspector |
|---|
|  |  |  |
| 3D computed tomography | yes (optional) | yes (optional) | no |
|---|
| max. inspection area | 24” x 22” | 24” x 22” | 24“ x 18“ |
|---|
| real-time detector resolution | 2 MPixel and 24" monitor | 2 MPixel (optional 4 MPixel) and 24" monitor | 848 x 480 Pixel |
|---|
| detail detectability | <1µ | <0,3µ (300nm) | <2µ |
|---|
| max. magnification | up to 23.320x | up to 25.000x | up to 460x |
|---|
| automated X-ray inspection | BGA, CSP, QFP, QFN, PTH, Voiding Calculation, Wire Sweep | BGA, CSP, QFP, QFN, PTH, Voiding Calulation, Wire Sweep | BGA, Voiding Calculation |
|---|
| max. tube voltage | 180kV | 180kV | 130kV |
For application examples, please go to Semiconductors and other electronic components.