In the inspection of sensors and electronic components, high-resolution X-ray technologies are mostly used to inspect and evaluate contacts, joints, cases, insulators and the situation of assembly. It is even possible to inspect semiconductor components and electronic devices (solder joints) without having to disassemble the device.
 | Loose contact of a crimp connection inside a switch: The microfocus X-ray image shows some loose wire strands outside the crimp. The stranded wires inside the crimping zone are only loosely crimped and therefore differentiable. This defect does not adversely affect the compressive strength, since there are enough strands inside the crimp. |
 | Microfocus-computed tomography of a crimp connection with a crimp height of 1.4 mm. To determine the number of individual strands and the crimping density, three tomographic layers, of the inlet area, the outlet area and the crimping zone itself (green), are generated: 19 strands enter, but only 17 exit the crimping zone. Due to the lack of material, small voids developed inside the crimping zone. |
 | Two broken wires on the stator winding of the electromotor. |
 | Oblique view Microfocus X-ray image of four contacts inside a relay. The left contact failed due to overstress. |
 | Microfocus-computed tomographic image of a lamda probe (connector-side view) showing the Inconell-protective case (yellow), including laser welded seams, crimp connections (blue) and contacts of the ceramic oxygen sensor (blue/red). |