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microme|x α

The microme|x α is a high-resolution, automated X-ray inspection system for inspecting electronic components; also available with automated component feeding.

Possible applications include:

• Mounted printed circuit boards/electronic assemblies- solder joints
• Multilayer printed circuit boards (Through-holes, misregistration, defective etching and metallization)
• Smaller mechanical components such as plug-in connectors and cases
  

Special features:

• Max. inspection area of 16“ x 20“
• Detail detectability of <1µ
• Real-time detector resolution of 2 megapixel
• Max. magnification up to 18.000x
• Automated X-ray inspection of BGAs, CSPs, QFPs, QFNs, PTHs, Voiding Calculation
• Automated loading and unloading (optional)
  
• Low-maintenance, long-life (open) submicron X-ray tube
• Ergonomically designed control panel
• Intuitive operation
• 20“ TFT display
• Steplessly adjustable projection angle up to 70°, rotation 0°-360°
• Easy-view-configuration: The X-ray image shows the object exactly as the operator sees it through the radiation protection window.

For more information on this particular X-ray inspection system, please contact us, we will be more than glad to answer your question!

microme|x	microme|x λ
The microme|x is a high-resolution submicron X-ray system for the inspection of solder joints and electronic components. Equipped with the fully automated µAXI inspection software x|act, the microme|x offers fast and easy CAD programming as well as highest defect coverage and repeatability. more...	The microme|x λ is a high-resolution, automated X-ray inspection system for inspecting large electronic components. more...

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