microme|x λ
The microme|x λ is a high-resolution, automated X-ray inspection system for inspecting large electronic components.
Possible applications include:
Special features:
- Extra large inspection area of 24“ x 20“
- Detail detectability of <1µ
- Real-time detector resolution of 2 megapixel
- Max. magnification up to 18.000x
- Automated X-ray inspection of BGAs, CSPs, QFPs, QFNs, PTHs, voiding calculation
- Max. object weight of 5 kg/ 11.01 lb
- Low-maintenance, long-life (open) submicron X-ray tube
- Ergonomically designed control panel
- Intuitive operation
- 20“ TFT display
- Steplessly adjustable projection angle up to 70°, rotation 0°-360°
- Easy-view-configuration: The X-ray image shows the object exactly as the operator sees it through the radiation protection window.
For more information on this particular X-ray inspection system, please
contact us, we will be more than glad to answer your question!
| microme|x | microme|x α |
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| The microme|x is a high-resolution submicron X-ray system for the inspection of solder joints and electronic components. Equipped with the fully automated µAXI inspection software x|act, the microme|x offers fast and easy CAD programming as well as highest defect coverage and repeatability.
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| The microme|x α is a high-resolution, automated X-ray inspection system for inspecting electronic components; also available with automated component feeding.
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